- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 23/482 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements consisting of lead-in layers inseparably applied to the semiconductor body
Patent holdings for IPC class H01L 23/482
Total number of patents in this class: 919
10-year publication summary
95
|
89
|
91
|
104
|
91
|
91
|
83
|
68
|
63
|
19
|
2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Taiwan Semiconductor Manufacturing Company, Ltd. | 36809 |
65 |
Semiconductor Components Industries, L.L.C. | 5345 |
43 |
Infineon Technologies AG | 8189 |
32 |
Rohm Co., Ltd. | 5843 |
30 |
Intel Corporation | 45621 |
26 |
Renesas Electronics Corporation | 6305 |
21 |
Mitsubishi Electric Corporation | 43934 |
21 |
Samsung Electronics Co., Ltd. | 131630 |
20 |
Toshiba Corporation | 12017 |
18 |
Texas Instruments Incorporated | 19376 |
16 |
Qualcomm Incorporated | 76576 |
15 |
GaN Systems Inc. | 83 |
14 |
Fuji Electric Co., Ltd. | 4750 |
13 |
Infineon Technologies Americas Corp. | 768 |
13 |
Micron Technology, Inc. | 24960 |
12 |
Cree, Inc. | 1157 |
12 |
NXP USA, Inc. | 4155 |
12 |
Wolfspeed, Inc. | 542 |
12 |
Samsung Display Co., Ltd. | 30585 |
11 |
Murata Manufacturing Co., Ltd. | 22355 |
11 |
Other owners | 502 |